CircuitMedic

CircuitMedic CS015020AS Circuit Frame BGA Pads .015"/.020"

246SO0201 MFG #: CS015020AS
$47.00 / EA
0
  • Base Material: Copper Foil
  • Coating: Bright Tin
  • Frame Size: 2.25 x 1.5, 2.25 x 1.5"
  • Lead Free Solder Compatible: Yes
  • Backing Material: Phenolic Butral Film
  • Bonding Temperature: 475
  • Bonding Temperature UOM: °F
  • Bonding Time: 30, 30 sec.
  • Bonding Time UOM: sec.
  • Drill Down Description: Circuit Frame BGA Pads .015"/.020", Circuit Frame BGA Pads .015inch/.020inch
  • Frame Size UOM: ", inch
  • Lands Diameter: 0.015, 0.02, 0.015, 0.02"
  • Lands Diameter UOM: ", inch
  • Model: CS015020AS
  • Peel Strength: 8, 8 lb./in.
  • Peel Strength UOM: lb./in.
  • Primary Keyword: Circuit Frame
  • UNSPSC: 23271700