CircuitMedic CS015020AS Circuit Frame BGA Pads .015inch/.020inch

246SO0201 MFG #: CS015020AS
$47.00 / EA
3
  • Base Material: Copper Foil
  • Coating: Bright Tin
  • Frame Size: 2.25 x 1.5
  • Lead Free Solder Compatible: Yes
  • Backing Material: Phenolic Butral Film
  • Bonding Temperature UOM: °F
  • Bonding Time: 30
  • Bonding Time UOM: sec.
  • Drill Down Description: Circuit Frame BGA Pads .015inch/.020inch
  • Frame Size UOM: inch
  • Lands Diameter: 0.015, 0.02
  • Lands Diameter UOM: inch
  • Model: CS015020AS
  • Peel Strength: 8
  • Peel Strength UOM: lb./in.
  • Primary Keyword: Circuit Frame

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