Kester Solder Paste Water Soluble Lead Free Sn96.5Ag3.0Cu0.5 89.5 % T3 500 g Jar EM828 Series
488SO3208
$90.00
/ EA
- Alloy: Sn96.5Ag3.0Cu0.5
- Flux Type: Water Soluble
- Halogen Content: Halogen
- Lead Type: Lead Free
- Metal %: 89.5 %
- Package Type: Jar
- Powder Mesh Size: T3
- Series: EM828 Series
- Volume: 500 g
- Application: Screen/Stencil Printing
- Drill Down Description: Solder Paste, Water Soluble, Lead Free, Sn96.5Ag3.0Cu0.5, 89.5 %, T3, 500 g Jar, EM828 Series
- Initial Tackiness UOM: g
- Lead Free: Yes
- Package: 500g Jar
- Primary Keyword: Solder Paste