Kester 7004030810 Solder Paste Water Soluble Lead Free Sn96.5Ag3.0Cu0.5 89.5 % T3 500 g Jar EM828 Series

488SO3208 MFG #: 7004030810
$105.00 /
  • Alloy: Sn96.5Ag3.0Cu0.5
  • Flux Type: Water Soluble
  • Halogen Content: Halogen
  • Lead Type: Lead Free
  • Metal %: 89.5 %
  • Package Type: Jar
  • Powder Mesh Size: T3
  • Series: EM828 Series
  • Volume: 500 g
  • Application: Screen/Stencil Printing
  • Drill Down Description: Solder Paste, Water Soluble, Lead Free, Sn96.5Ag3.0Cu0.5, 89.5 %, T3, 500 g Jar, EM828 Series
  • Initial Tackiness UOM: g
  • Lead Free: Yes
  • Model: 7004030810
  • Package: 500g Jar
  • Primary Keyword: Solder Paste

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