Air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems. Exceptional stencil print transfer efficiency to work in the broadest range of processes. High oxidation resistance virtually eliminates incomplete coalescence (graping) of small deposits and head-in-pillow defect. 500g jar.
* Low voiding on QFN, BGA, and CSP components
* High transfer efficiency and low variation through small apertures (?0.66 AR)
* Outstanding RF shield metallization wetting.
Powder Size: Type 4
Metal Load: 88.5%