AIM Solder 21602-07-00 WS488 Solder Paste, Water Soluble, SAC305, T4, 500g Jar
Our Part #592-455
Condition:New
Mfr Part #21602-07-00
Next Day Air Only
Has Expiration Date
$114.40EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $114.40 | |
| 5 | $108.68 | Save |
| 10 | $105.25 | Save |
| 20 | $100.67 | Save |
Multiples of: 30
- Description
- Specifications
- Excellent wetting
- Extended cleaning window
- Superior slump resistance
- Large process window
- Aqueous wash with water
- J-STD-004 ORM1
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life.
Brand: AIM Solder
Alloy Name: SAC305
Flux Type: Water Soluble
Lead Free: Yes
Powder Mesh Size: T4
Metal %: 0.885
Alternate Product Number: 21602-07-00
Container Type: Jar
Container Volume: 500 g
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Series: WS488 Series
Shelf Life: 180 days
Type: Solder Paste
Viscosity: 600-1000 Kcps Typical
Water Soluble: Yes
$114.40EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $114.40 | |
| 5 | $108.68 | Save |
| 10 | $105.25 | Save |
| 20 | $100.67 | Save |
Multiples of: 30