AIM Solder 89047-18-00 RMA258-15R Solder Paste, Rosin, Leaded, Sn63Pb37, T4, 500g Jar
Our Part #592-456
Mfr Part #89047-18-00
AIM Solder 89047-18-00 RMA258-15R Solder Paste, Rosin, Leaded, Sn63Pb37, T4, 500g Jar
Our Part #592-456
Condition:New
Mfr Part #89047-18-00
Next Day Air Only
WARNING
Has Expiration Date
Condition:New
Next Day Air Only
Calif. Prop 65
Has Expiration Date
- Description
- Specifications
- Documents
- Long Pause-to-Print Capabilities
- Excellent Wetting. Even Leadless Devices
- Enhances Fine Print Definitions
- Exceptional Reflow During Long, Hot Profiles
- ROL0 per IPC J-STD-004
- Reduced Voiding
RMA258-15R rosin based solder paste has been developed for assemblers of high reliability and military electronics. RMA258- 15R offer long pause-to-print capabilities even on miniaturized devices. RMA258-15R reduces voiding on BGA/BTC and eliminates head-in-pillow defects. Powerful activators in RMA258- 15R produce bright, smooth and shiny solder joints. RMA258-15R is capable of withstanding long hot reflow profiles common to high mass assemblies such as backplanes and power management. RMA258-15R residues have been formulated for removal in vapor degreaser, solvent and saponifed wash systems.
Brand: AIM Solder
Alloy Name: Sn63/Pb37
Flux Type: Rosin
Lead Free: No
Powder Mesh Size: T4
Package Type: Jar
Alloy Type: Eutectic Alloys
Composition: 63/37 (63% Tin, 37% Lead)
Container Type: 500g Jar
Melting Point: 183 C (361 F)
Shelf Life: 365 days
Type: Solder Paste
Viscosity: Print/Dispense