• Low charging polyimide film (2.4 Mils Thick) with polysiloxide adhesive
• Surface resistance 1 x 10⁸ to < 1 x 10¹¹ ohms Tested per ANSI/ESD S11.11
• Temperature resistance to a maximum of 572°F (300°C) for10 Second Max

Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits. Generates less 50 volts when unwound from roll (at 73°F, 45% RH average) making it safe to use around most ESD sensitive items. May be exposed to high temperatures for wave soldering and other applications without leaving residue when removed.