Loctite 2840907 Eccobond Underfill 1173, Black, 30CC Varidot Cartridge

• Void-free Low coefficient of thermal expansion (CTE) 48-hour pot life at 25°C (77°F)

The LOCTITE ECCOBOND UF 1173 is a 1-part, epoxy-based underfill, which maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It has a long pot life and exhibits low-CTE properties to improve the bond strength and stability. Ideal for void-free encapsulation of electronic packages.