TestEquity
Information notification:

October Exclusive: 10% Off Solder Wire & Bars – Online Only – Use Code SOLDER10

Loctite
Loctite

Loctite 2063673 Reworkable Epoxy, Underfill, 5cc Syringe, Halogen free, Low-Viscosity

Our Part #10033996

Mfr Part #2063673

Loctite 2063673
Loctite
Loctite

Loctite 2063673 Reworkable Epoxy, Underfill, 5cc Syringe, Halogen free, Low-Viscosity

Our Part #10033996

Condition:New

Mfr Part #2063673

Requires Dry Ice
Has Expiration Date
$27.82EACH
Quantity on Order:54
Manufacturer Lead Time :79 Days
Qty:Price:Savings
1$27.82
10$27.26Save
50$26.43Save
100$25.04Save
200$24.48Save

Condition:New

Requires Dry Ice
Has Expiration Date

LOCTITE® ECCOBOND UF 3811

Halogen-free, low-viscosity reworkable underfill

LOCTITE® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill specially designed for Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.

Features:
  • Room temperature flow
  • Low viscosity
  • High glass transition temperature (Tg)
  • Fast cure at moderate temperatures
  • No preheating required

Product Details:

  • Technologies: Thermosets, electronics assembly materials
  • Coefficient of thermal expansion (CTE), Above Tg: 190.0 ppm/°C
  • Coefficient of thermal expansion (CTE), Below Tg: 61.0 ppm/°C
  • Cure schedule, @ 100.0 °C: 60.0 min.
  • Glass transition temperature (Tg): 124.0 °C
  • Viscosity, Brookfield, Physica, @ 25.0 °C: 354.0 mPa·s (cP)

BrandLoctite
Shelf Life365 days
$27.82EACH
Quantity on Order:54
Manufacturer Lead Time :79 Days
Qty:Price:Savings
1$27.82
10$27.26Save
50$26.43Save
100$25.04Save
200$24.48Save
Empowering the entire electronics lifecycle

Copyright © 1996–  TestEquity LLC.
All rights reserved.