LOCTITE® ECCOBOND UF 3811

Halogen-free, low-viscosity reworkable underfill

LOCTITE^® ECCOBOND UF 3811 is a halogen-free, reworkable, low-viscosity epoxy underfill specially designed for Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing.

• Room temperature flow
• Low viscosity
• High glass transition temperature (Tg)
• Fast cure at moderate temperatures
• No preheating required

Product Details:

• Technologies: Thermosets, electronics assembly materials
• Coefficient of thermal expansion (CTE), Above Tg: 190.0 ppm/°C
• Coefficient of thermal expansion (CTE), Below Tg: 61.0 ppm/°C
• Cure schedule, @ 100.0 °C: 60.0 min.
• Glass transition temperature (Tg): 124.0 °C
• Viscosity, Brookfield, Physica, @ 25.0 °C: 354.0 mPa·s (cP)