Loctite 135255 Thermally Conductive Adhesive system, 25mL Syringe, 383 Series

The Loctite 383 thermally conductive adhesive is a modified acrylic solution designed for bonding heat-generating electronic components to heat sinks, housings, or printed circuit boards. It combines structural strength with reliable heat dissipation, helping maintain performance and stability in demanding electronic assemblies.

With its high viscosity, the Loctite 383 stays in place during application, making it well suited for vertical or uneven surfaces. It cures at room temperature and can be used with an activator when required for faster or more controlled processing.

Specifications & Capabilities:

• Modified acrylic thermal conductive adhesive formulation
• Thermal conductivity: 0.602 W/m·K for effective heat transfer
• High viscosity: ~1,100,000 cP for controlled placement
• Room-temperature cure; activator compatible depending on application
• Maximum voltage resistance: up to 500V (high-pot applications)
• Gray color for clean visibility during assembly
• Designed for bonding transformers, transistors, and heat sinks

Designed for Thermal Management in Electronics

The Loctite 383 is engineered for applications where both adhesion and thermal performance matter. It helps transfer heat away from sensitive components, supporting longer service life and improved reliability in electronics manufacturing, power supplies, and industrial control systems.

Reliable Bonding with Heat Dissipation

This thermal conductive adhesive provides a strong mechanical bond while maintaining consistent thermal pathways. Its formulation makes it suitable for assemblies that require both structural integrity and efficient heat management without adding mechanical fasteners.

The Loctite 383 offers a practical balance of strength, viscosity, and thermal conductivity—making it a dependable choice for precision electronics bonding and heat management applications.