
$371.54EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $371.54 | |
| 5 | $352.96 | Save |
| 10 | $341.82 | Save |
| 20 | $326.96 | Save |
Multiples of: 10
Condition:New
Has Expiration Date
- Description
- Specifications
- Documents
LOCTITE 3563 is a rapid-curing, fast-flowing liquid epoxy underfill designed for capillary flow applications in packaged ICs such as CSPs and BGAs. Its optimized rheology penetrates gaps as small as 25 µm. When fully cured, it minimizes induced stress at solder joints, significantly improving thermal cycling performance. A reworkable solution for enhanced PCB assembly reliability.
Brand: Loctite
Viscosity: 12000 cP
Cure Time: 30 min.
Product Type: Underfill
Series: 3563 Series
$371.54EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $371.54 | |
| 5 | $352.96 | Save |
| 10 | $341.82 | Save |
| 20 | $326.96 | Save |
Multiples of: 10
