CircuitMedic
CircuitMedic B6-324-2323-100 Flextac Rework Stencil, Polymer, BGA, 324 Balls, 23mmx23mm, 10/Pkg
Our Part #246SO423
Mfr Part #B6-324-2323-100
CircuitMedic
CircuitMedic B6-324-2323-100 Flextac Rework Stencil, Polymer, BGA, 324 Balls, 23mmx23mm, 10/Pkg
Our Part #246SO423
Condition:New
Mfr Part #B6-324-2323-100
$129.00Pack
Multiples of: 5
- Description
- Specifications
- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Eliminates tedious stencil cleaning (Disposable)
- Conforms to the board surface (Flexible)
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
Brand:Â CircuitMedic
ESD Safe:Â Yes
Material:Â Polymer
Package Quantity:Â 10 Per Pkg.
Product Type:Â Flextac Rework Stencils
Series:Â B6 Series
Thickness:Â 0.004 in.
Mounting Type:Â BGA
Pitch:Â 1 mm
Applications:Â Applying Solder Paste for BGA Rework
Component Length:Â 40.000 mm
Component Width:Â 40.000 mm
Number of Balls:Â 324
$129.00Pack
Multiples of: 5