• Wide reflow process window
• Consistent fine-pitch print deposition
• Superior tack strength
• Exceptional wetting in air reflow

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

RMA-SMQ® 51AC Solder Paste

RMA-SMQ®51AC is an air reflow, RMA solder paste designed for use in a wide range of environmental conditions. It has exceptional stencil life and tack strength, and offers consistent print definition even in ultrafine-pitch applications. RMA-SMQ®51AC’s wide processing window allows it to be used with standard eutectic SnPb, SnPbAg, and high-temperature alloys, including AuSn, SnSb, and SnAg.