• Designed for flip-chip dipping applications
• Tackiness suitable for holding die during assembly
• Bubble-free airless packaging
• Ultra-low residue
• Halogen-free
• No-clean

Flip-Chip Flux NC-26-A is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.