AIM Solder 89351-13-00 M8 Solder Paste, No Clean, Low Tombstoning, Sn63Pb37, T4, 500g Jar
Our Part #10060497
Condition:New
Mfr Part #89351-13-00
Next Day Air Only
WARNING
Has Expiration Date
$207.93Each-EA
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $236.28 | |
| 2 | $224.47 | Save |
| 5 | $212.65 | Save |
| 10 | $207.93 | Save |
Minimum order quantity: 30
Order in multiples of: 30
- Description
- Specifications
- Documents
AIM Solder M8-SN63-LT3-T4 JAR Solder Paste
M8 no clean solder paste brings performance to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny joints. M8 has reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads. M8 passes stringent automotive and high reliability SIR and electrochemical test requirements.
Features and Benefits
Brand: AIM Solder
Alloy Name: Sn63/Pb37
Flux Type: No Clean
Lead Free: No
Container Volume: 500 g
Alloy Type: Eutectic Alloys
Composition: 63/37 (63% Tin, 37% Lead)
Melting Point: 183 C (361 F)
Shelf Life: 3 (Unrefrigerated) mo.
Type: Solder Paste
Viscosity: 70-300 Pa.S
$207.93Each-EA
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $236.28 | |
| 2 | $224.47 | Save |
| 5 | $212.65 | Save |
| 10 | $207.93 | Save |
Minimum order quantity: 30
Order in multiples of: 30