• Ultimate Process Control
• Advanced Thermal Performance
• Unsurpassed Productivity
• Outstanding Energy Efficiency

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA and SMD components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 1800 BGA/SMD Rework System - With its groundbreaking, patent-pending Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.■ ■ Top-Side Heater: Fast Heat Up - Rapid Cool Down
PACE's Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 1800 immediately drops to temperatures well below solder melt when the heater is de-energized.■ ■ How It Works■ The TF 1800’s Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work. The air is first pre-heated in the outer chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber. It’s then heated to target temperature through a highly efficient heat transfer process in an energized induction field. During active cooling, the induction coil is de-energized. The heater’s unique low thermal mass design further enhances the system’s ability to heat up and cool down quickly and gives the operator an unsurpassed level of process control in developing thermal profiles for the particular rework task at hand.