
Calif. Prop 65
Has Expiration Date
- Description
- Specifications
- Documents
- Suitable for pin grid array and standard ball grid array applications
- Airless packaging
- Excellent solderability to all common surface metallizations
- No-clean residue
- Can be used for printing, dipping, and pin transfer deposition
- Offers high yields in BGA bumping process
- Suitable for both Pb-free or SnPb applications
NC-506 Ball-Attach Flux is a low-viscosity thixotropic no-clean flux
designed for use in ball-attachment to substrates (BGA manufacturing). It
is especially useful in applications requiring soldering to surface finishes
with tenacious oxides, such as nickel. It can also be used wherever a
no-clean ball-attach flux is needed, and is suitable for a variety of
different deposition methods.
Brand: Indium
Flux Type: ROL1
Lead Free: Yes
Alternate Product Number: Indium Tac Flux NC-506 30CC SYRINGE
Color: Light Yellow
Container Size: 30 cc
Container Type: Syringe
Flux Characteristics: No-Clean
Physical State: Tacky
Product Type: Soldering Flux
Series: NC-506 Series
Shelf Life: 360 days
Volume: 25 g