Loctite 1771462 Eccobond FP4451TD 30cc Syringe

The Loctite ECCOBOND FP4451TD (1771462) is a high-purity, heat-cure epoxy encapsulant designed for semiconductor and microelectronics protection. It is commonly used as both an encapsulant and a damming material, helping control material flow while shielding sensitive components during assembly.

This epoxy formulation is well suited for bare die and chip-level applications where precision, cleanliness, and thermal stability are critical. Its high viscosity supports controlled placement, forming consistent barriers and protective layers around delicate circuitry.

Specifications & Capabilities:

• Model: 1771462
• High-purity epoxy encapsulant for semiconductor and microelectronics applications
• Supplied in a 30cc syringe for precision dispensing
• Viscosity: 300,000 cP for controlled flow and damming performance
• Cure type: heat cure (approximately 30 minutes)
• Color: black
• Designed for chip encapsulation, die protection, and flow control barriers
• Suitable for electronics encapsulation, semiconductor packaging, and precision dispensing systems

Designed for Semiconductor Encapsulation

The Loctite ECCOBOND FP4451TD is engineered to protect active electronic components from environmental and mechanical stress. It acts as a protective barrier around sensitive devices, supporting long-term reliability in high-performance electronics.

Controlled Flow for Precision Applications

With its high viscosity, the Loctite ECCOBOND FP4451TD maintains precise placement without spreading, making it effective for damming and encapsulation in tight geometries. This control is essential for consistent results in semiconductor packaging and microelectronic assembly.

The Loctite ECCOBOND FP4451TD (1771462) provides a reliable balance of purity, flow control, and protective performance, making it a practical choice for epoxy encapsulation in advanced electronics manufacturing.