• Halogen-free—no intentionally added (NIA) halogens
• Suitable for Pb-free or SnPb alloys
• Designed for flip-chip dipping applications
• Ultra-low residue
• Compatible with underfills
• Bubble-free (airless) packaging

Flip-Chip Flux NC-510 is a NIA halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.

Application

NC-510 is intended to be used in a nitrogen reflow environment of 100pmm oxygen or less. Some applications can utilize this material in an air environment, although best results will be obtained in an inert atmosphere. NC-510 can be used on many surface finishes including Immersion Ag, Cu-OSP, AuNi, and AuPdNi, and is compatible with all standard flip-chip solders.

Compatibility

The compatibility of flip-chip flux residues with epoxy-based capillary underfills is determined by measuring the shear strength of the interface between the post reflow flux and the cured underfill. The best results for Flip-Chip Flux NC-510 have been observed with both amine- and acid anhydride-based capillary underfill chemistries.

Cleaning

NC-510 is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner. Please contact an Indium Corporation Technical Support Engineer for recommendations of cleaners to suit your process needs.

Storage

NC-510 syringes and cartridges should be stored tip down at 0 to 30deg C for maximum shelf life. NC-510 should be allowed to reach ambient temperature before use.