8327GL5 is a 1-part, silicone-free, high temperature, soft gel offering very high thermal conductivity and flame retardancy. This form-inplace, non-curable gel is easy to dispense and conforms to the component/heatsink interface, ensuring all air is displaced and eliminating hotspots. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience.

It is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs.

Features & Benefits:

• Very high thermal conductivity
• Flame retardant—meets UL94 V-0
• High temperature stability
• 1-part, non-curable, dispensable gel
• Zero pump out—no slump under lowpressure
• Silicone-free, will not contaminate surfaces
• Low modulus, ideal for aggressive thermalcycling conditions