8327GL6 is a 1-part, silicone-free, paste-like gel offering extreme thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the component/heatsink interface, ensuring all air is displaced and eliminating hotspots. Its low modulus and robust temperature range allows for high heat dissipation, low component stress and thermal cycling stability. Circuits can be powered up immediately following application, offering exceptional convenience.

It is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs.

Features & Benefits:

• Features & BenefitsFeatures & Benefits
• Extreme thermal conductivity
• Flame retardant—meets UL94 V-0
• 1-part, non-curable, dispensable gel
• Zero pump out—no slump under lowpressure
• Silicone-free, will not contaminate surfaces
• Low modulus, ideal for aggressive thermalcycling conditions