Chip Quik NC191LTA10 Solder Paste, No-Clean, Lead-Free, T4 86.75%, Sn42/Bi57/Ag1, 10g Syringe

• Alloy: Sn42/Bi57/Ag1
• Flux Type: Synthetic No-Clean
• Flux Classification: ROL0
• Metal Content: 86.75% metal by weight.
• Particle Size: T4 (20-38 microns)
• Melting Point: 137C (279F)
• Size: 3cc/10g syringe

Developed with a lower density flux vehicle for better shear spread and improved flow during heating

Shelf Life
Refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)


Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.