EasySpheres 10-1090-08 Solder Balls, Sn10Pb90, 0.008-0.200mm Dia, ESD 10K Jar, 1090 Series
Our Part #10233539
Condition:New
Mfr Part #10-1090-08
WARNING
- Description
- Specifications
- Documents
EasySpheres Sn10Pb90 Solder Balls are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers. Our solder balls are compliant to J-STD-006 and are QR coded for lot conformance traceability and shipping accuracy.
Brand: EasySpheres
Alloy Name: Sn10Pb90
Diameter: .008-0.200 mm
Melting Point: 275 C (527 F)
Package Quantity: 10K Per Jar
Package Type: Jar
Lead Type: Leaded
Series: 1090 Series
Alloy Type: Non-Eutectic Alloys
Composition: 10/90 (10% Tin, 90% Lead)
Lead Free: No
Liquidus Point: 302 C (576 F)
Melting Range: 275-302 C (527-576 F)
Warranty Information: EasySpheres warrants this product to be defect free, with a controlled size distribution per specification and an alloy purity which is in compliance of IPC-JSTD-006 guidelines. Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.