EasySpheres 10-3005-24 Solder Balls, Sn96.5Ag3Cu0.5, 0.024-0.600mm Dia, ESD 10K Jar, 3005 Series
Our Part #10233568
Condition:New
Mfr Part #10-3005-24
WARNING
RoHS
- Description
- Specifications
- Documents
EasySpheres SAC305 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature: 221(°C)
Brand: EasySpheres
Alloy Name: Sn96.5Ag3Cu0.5
Diameter: .024-0.600 mm
Melting Point: 217 C (423 F)
Package Quantity: 10K Per Jar
Package Type: Jar
Lead Type: Lead Free
Series: 3005 Series
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Lead Free: Yes
Liquidus Point: 220 C (428 F)
Melting Range: 217-220 C (423-428 F)
Warranty Information: EasySpheres warrants this product to be defect free, with a controlled size distribution per specification and an alloy purity which is in compliance of IPC-JSTD-006 guidelines. Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.