• Meets the requirements of J-STD-004 Type ROL0
• More heat-stable than rosin-free formulas
• More active than most other no-clean formulas
• Wide process window for soldering larger and/or thick circuit boards
• Tested compatibility with a wide range of selective solder operations
• Leaves a smaller amount of post-soldering residue than most ROL1 and ROL0 formulas
• Tested compatibility with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper surfaces
• Tested for use with all common lead-free and tin-lead alloys, including: SAC305; SAC105; SAC0307; silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995; 96.5Sn/3.5Ag; 63Sn/37Pb; 60Sn/40Pb; and many others

WF-9940 is Indium Corporation’s most active and heat-stable low-solids rosin-containing no-clean wave solder flux. WF-9940 was developed to meet the original requirements of J-STD-004 as a ROL0 and for effectively soldering through-hole and mixed-technology assemblies. It performs well with both tin-lead and lead-free solders. WF-9940 is very heat-stable and well-suited for selective soldering applications. With strong soldering performance, WF-9940 passes all common reliability requirements. It is non-corrosive and does not contribute to detrimental circuit board insulation resistance degradation or electrochemical migration.