3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Standard Lead Time: 35 Calendar Days

• Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
• Transparency allows for inspection without tape removal
• High instant adhesion to substrate
• Good holding power

• Color: Green
• Part Number: 3305 PL
• Width: 2.165 in