3M 7010321285 Wafer De-Taping Tape 3305, 25 mm x 100 m
Our Part #10291471
Mfr Part #7010321285
3M 7010321285 Wafer De-Taping Tape 3305, 25 mm x 100 m
Our Part #10291471
Condition:NEW
Mfr Part #7010321285
$38.06Roll
Multiples of: 40
Condition:NEW
- Description
- Specifications
- Documents
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Standard Lead Time: 35 Calendar Days
Features:- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
- Color: Green
- Part Number: 3305 PL
- Width: 2.165 in
Brand: 3M
Series: 3305 Series
Type: Delaminating Tape
Color: Green
Width: 25 mm
Length: 100 m
Applications: Removal of silicon wafer backgrinding tape
Material: Polyester
$38.06Roll
Multiples of: 40