• High Tg
• Low CTE
• Low stress
• High flow speed
• Electrically Insulating
• Fast cure at low temperatures
• Superior adhesion after moisture testing
• Excellent flow characteristics for high density arrays

LOCTITE ECCOBOND UF 8807 is formulated using a novel Moisture Resistant Cyanate Ester (MRCE) chemistry. This material's characteristics help to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications. An optimized particle size distribution allows LOCTITE ECCOBOND UF 8807 adhesive to flow rapidly into gaps of 10 mil and greater to form a protective polymer when cured.