LOCTITE 3874 is a thermally conductive adhesive. When used with Activator 7387™, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. Typical applications include bonding heat sinks to heat dissipating components such as BGAs in electronics applications. The thixotropic nature of LOCTITE 3874 reduces the migration of liquid product after application to the substrate.