• One component
• Fast cure at low temperatures
• Low cure temperature
• Void-free underfill
• Low CTE
• Non-anhydride curing chemistry
• Long pot life

LOCTITE ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.