Loctite 232221 Silicone Adhesive

SI 5404 is designed to bond metallic heat sinks,ceramic chips and circuit board substrates. LOCTITE® SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. A typical application would be the bonding of any power semiconductor, module,graphics processor or other heat generating device to a heat sinkor metal enclosure in an electronics circuit.

Features:

• Color: White
• Odor: Mild
• Boiling Point: > 500°F
• Specific Gravity: 2.338
• Flash Point: > 199.4°F
• VOC Content: 1.5%