Loctite 2420246 Epoxy Underfill

ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.

Features:

• Color: Black
• Odor: Slight
• Specific Gravity: 1.68
• Flash Point: > 230°F
• VOC Content: < 1%