
$654.62Each-EA
Multiples of: 10
- Description
- Specifications
- Documents
Loctite 2420246 Epoxy Underfill
ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
Features:
- Color: Black
- Odor: Slight
- Specific Gravity: 1.68
- Flash Point: > 230°F
- VOC Content: < 1%
Brand: Loctite
Product Type: Underfill
Adhesive Type: Epoxy
Applications: Bonding
Cure Type: Heat Cure
Color: Black
Container Size: 55 cc
Series: UF 1173 Series
Shelf Life: 180 days
$654.62Each-EA
Multiples of: 10
