Loctite 498794 Epoxy Encapsulant

ECCOBOND FP4546 liquid epoxy encapsulant is specially suited for use on flip-chip devices requiring improved crack/fracture resistance. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.

Features:

• Color: Black
• Odor: None
• Specific Gravity: 1.6
• Flash Point: 266°F