
Condition:NEW
- Description
- Specifications
- Documents
Fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.
Features:
- High tensile strength (2,500 psi)
- Good solvent resistance to gas, oil and other solvents
- Non sag which makes it ideal for use on vertical surfaces
- Excellent gap filling qualities without tremendous shrinkage
- Fast curing for bond tags on machinery and equipment
- Hardness: 80Shore D
- Material Compatibility: Metal, Ceramic, Wood
- Chemical Composition: Phenol,Polymer With Formaldehyde,Glycidyl Ether, Inert Material, Phenol,Polymer With Formaldehyde,Glycidyl Ether
- Peel Strength: 2 to 3pli
- Cure Type: Room 75°F
- Elongation at Break: 5%
- Applications: Bonding, Potting, Encapsulating
Brand: Devcon
Container Type: Cartridge
Physical Form: Viscous Liquid
Cure Time: 48 hrs.
Dielectric Strength: 440 V/Mil
Mix Ratio: 1:1
Product Type: Epoxy Adhesive
Shelf Life: 1125 days
Specific Gravity: 1.1 to 1.3
Temperature Range: -40 to 200°F
Tensile Strength: 2500 psi