• Wide reflow process window
• Consistent fine-pitch print deposition
• Superior tack strength
• Exceptional wetting in air reflow

RMA-SMQ®51AC is an air reflow, RMA solder paste designed for use in a wide range of environmental conditions. It has exceptional stencil life and tack strength, and offers consistent print definition even in ultrafine-pitch applications. RMA-SMQ®51AC’s wide processing window allows it to be used with standard eutectic SnPb, SnPbAg, and high-temperature alloys, including AuSn, SnSb, and SnAg.