Kester R562 is an organic acid, water-soluble solder paste specifically designed for resistance to environmental extremes. Water-soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes.

Features and Benefits:

• Reduces BGA voiding to <3%
• Bright, shiny joints
• 12 hour stencil life
• Print speeds up to 6 in/sec
• Compatible with enclosed print head systems
• Consistent printing over a range of temperatures and humanity
• Capable of mulitple reflow profiles before a cleaning operations is required
• Excellent solderability to a wide variety of metallizations, including Palladium
• Residues easily removed with hot DI water within 8 hours as best practice after processing
• Classified as ORM0 per J-STD-004
• Capable of off-pad printing with no solderballs after reflow dry out