• Reduces Tin Whisker Formation
• Lower Reflow/Solder Pot Temperature
• Low-Cost SAC Alloy
• Improved Wetting Versus All Low/No-Silver Alloys
• For use in Lead-Free Process
• Only Complies with IPC J-STD-006

AIM’s REL61TM is comprised of tin, bismuth, silver, copper micro-element grain structure refiners. REL61 provides the electronics assembly marketplace a low-cost alternative to SAC alloys that has reliability and performance characteristics equal to SAC305 and greater than other low/no-silver solder alloys. REL61 has shown to reduce tin whisker formation as well as outperforming low/no-silver alloys in thermal shock, vibration and drop shock resistance. Lower reflow and solder pot temperature can be used with REL61 versus other low/no silver alloys.