Multicore MF R301 is a no-clean high activity, resin-based halide-free liquid flux designed particularly for use on surfaces with poor solderability.

Features and Benefits:

• Lead free and tin-lead compatible
• Fast soldering on conventional leaded and SMD components - no bridges or icicles
• Exceptional through-hole penetration
• Sustained performance for maximum process window
• No cleaning - reduces costs
• Minimal residues to interfere with ATE probes without cleaning
• Compatible with rosin-based surface preservatives
• Foam, spray or wave applications

Applications:

MF R301 is recommended for consumer electronics and general electrical soldering applications using conventional wave soldering machines. The activator package is designed to enhance efficacy, especially when soldering to poorly preserved substrates/components. A small amount of rosin is complemented by the solvent package to ensure optimum drainage characteristics at the exit of the wave, minimising bridges, spiking and mid-pad solder balling. This leaves a small amount of non-corrosive residue.