
- Description
- Specifications
- Documents
- Excellent NWO performance
- Very wide reflow profile window under both air and nitrogen
- Excellent HIP performance
- Excellent soldering performance and process yield
- Clear post-reflow residue
Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium10.8HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Brand: Indium
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T4.5
Metal %: 0.89
Container Type: Jar
Container Volume: 500 g
