Multicore 2472691 Solder Paste, GC18, SAC305, T4, Pb Free, Halogen Free, Low Voiding, 500g/Jar

Halogen free, no-clean, low voiding, Pb-free solder paste specially formulated to provide low voiding when soldering Bottom-Terminated Components (BTC- QFN, DPAK and LGA). This material is also designed to enhance stability in printing applications.

Features and Benefits:

• Low Voiding: < 25% voiding across small and large BTC
• IPC Class III voiding for BGA/CSP
• Excellent soldering performance
• Good resistance to graping in demanding reflow profiles
• Excellent humidity resistance
• Minimal slump at room temperature and up to 190ºC
• Process capability: (Cpk) >2.0 for area ratios down to 0.50
• Stable on-stencil viscosity for improved printing consistency
• Reliability: Pass SIR and ECM independent of reflow profile
• Pin-testable post-reflow residues after four reflow cycles
• Compatibility with approved encapsulant technologies
• Stable at room temperature for enhanced sustainability