Multicore 2591111 Solder Paste, No Clean, LF, T5, 84%, Sn96.5Ag3Cu0.5, 25 Gram/Cartridge, GC50 Series

GC 50 solder paste is a halogen free, no-clean, Pb-free solder paste specially specially designed to provide enhanced stability when used in jetting and other dispensing applications.

Features

● Provides added long-term stability over a wide range of temperature conditions. Cpk >2.0 achievable with less than 50% tolerance
● High process capability for paste diameter targets of <300 μm using jetting technology
● Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
● Stable in ejector head for at least 1 week (up to 28°C/82°F).
● Suitable for use in time/pressure and auger pump dispensing systems
● Void-free packaging for improved process consistency and sustainability
● Stable at room temperature for enhanced sustainability
● Excellent soldering performance in air or in nitrogen
● Good resistance to graping in demanding reflow profiles
● IPC Class III voiding performance
● Post reflow residues readily removed with electronics industry solvents
● Compatible with Pb-free printing pastes in a solder additive process
● Eliminates the need for step-stencil or preforms