
- Description
- Specifications
- Documents
Tektronix MP5103 High-Density Modular Test Platform Mainframe, MP5000 Series
Specifications:
Form Factor: 1U rack-mountable chassis
Module Slots: 3 rear-access slots
Channel Density: Up to 6 channels per chassis (2 channels per module)
Scalability: Up to 32 mainframes via TSP-Link
Digital I/O: 18 pins for hardware handshaking
Interfaces: USB 3.0, 1 Gigabit Ethernet
Web Interface: Built-in, browser-based control and monitoring
Software Support: Python, LabVIEW, IVI, SCPI-compatible via TSP
TSP Toolkit:
Visual Studio Code-based IDE
On-instrument script debugging
Automated TSP script generation with channel sync
Python API integration
MODULAR ARCHITECTURE
Key Features:
Compact 1U mainframe offering significant space and cost efficiency over conventional rack-and-stack systems
3 configurable slots offer flexibility to mix & match PSU and SMU modules (not included with this Mainframe) to optimize the cost-performance tradeoff
Add or remove modules effortlessly without powering off the mainframe, thus reducing downtime
Additional digital I/O pins (18) support efficient handshaking with other test rack equipment
TSP-Link facilitates precise synchronization within 500 ns across multiple mainframes, ideal for high channel count parallel testing
Employs 1Gbps Ethernet and USB 3.0 for fast data streaming
Features a modern touch display for simplified setup and troubleshooting
The MP5000 Series is Tektronix’s next-generation modular precision test platform engineered to meet the evolving demands of automated test equipment (ATE) in validation and production workflows. Designed with a compact 1U form factor that supports up to six SMU or PSU channels per chassis and scales to 192 channels in parallel, native Python drivers, and the intuitive TSP Toolkit IDE, it delivers unmatched flexibility, performance, and automation for semiconductor, optoelectronics, and mission-critical applications.
This top-tier automated test equipment (ATE) optimizes rack space by incorporating multiple source measure units (SMUs) and power supplies (PSU) with adaptable module options. Featuring three slots and dual-channel modules, it offers up to six parallel channels. For higher channel count applications, TSP-Link™ provides a solution to connect mainframes in a master-subordinate configuration, effectively allowing them to function as one unit. This facilitates the creation of an optimized source and measurement system suitable for a wide range of applications, from validating design and debugging to complex parallel test system used in ATE.
Customers can mix and match module configurations to optimize cost, throughput, and accuracy. For applications where low current measurements and sinking capabilities aren't required, power supplies can be a cost-effective solution. For applications in which true current sourcing and high-speed measurements are required, consider an SMU module. The system supports a wide array of applications, and its high-density design conserves valuable rack space and reduces cost per channel. It's engineered to deliver fast throughput for high-channel parallel testing, saving both cost and time for production and validation test users.
Software
INTUITIVE, INTERACTIVE, INTERFACE
Intuitive Web Interface: A highly visual, interactive Web UI display designed for troubleshooting multi-channel setups and remote instrument monitoring
TSP Toolkit: Facilitates the development of Test Script Processor (TSP™) scripts for automation within the widely-used Microsoft Visual Studio Code (VS Code) editor. More information and downloads found on the TSP Toolkit Product Page
Supporting Drivers: Accelerate software development with drivers such as Python and IVI
In The Box
MP5103 1U Modular Mainframe (PSU and SMU Modules Sold Separately)
4299-15: Fixed 1U Rack Mount Kit
174745900: Digital I/O, 30 position rectangular socket to wire
CS-1616-3: Safety Interlock Connector
CA-179-2A: CAT5E, RJ-45 LAN cable, 10 ft
CA-568-120A: Grounding cable, 120 in.
174751000: USB-C Male to Male, Non Locking
Power Cord (region-specific)
Quick Start Guide / Safety Manual
Web Interface Access Instructions
Software & Drivers:
TSP Toolkit (Base Version) – Visual Studio Code-based IDE
Python & IVI Drivers
Utilize TSP commands
Access to Online Documentation and Example Scripts
FAQs: Frequently Asked Questions
1) Can I mix SMU and PSU modules in the same MP5103 mainframe?
Yes. The MP5103 supports mixed SMU (MSMU60-2 and MSMU200-2) and PSU (MPSU50-2ST) configurations, allowing you to customize performance, channel count, and cost within a single chassis.
2) Do I need to power down the mainframe to replace a module?
No. Independent slot power control enables module replacement and service without shutting down the entire system, helping reduce downtime.
3) Can the MP5103 scale for high-channel-count test systems?
Yes. Multiple MP5000 mainframes can be linked using TSP-Link™ technology, providing synchronized operation across large automated test systems.
4) Why is the MP5000 Series ideal for automated test environments?
The MP5000 Series combines high channel density, fast data connectivity, advanced automation tools, and scalable architecture in a compact 1U platform for efficient validation and production testing.
