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- Description
- Specifications
- Documents
Solder Paste, No-Clean, Sn42Bi58, 90%, T3, 50gm Jar. Low temperature solder paste, Sn42/Bi58. T3 (25-45 microns) particle size. 90% metal by weight, with a 138°C (281°F) melting point. 50g jar.
Brand:Â Chip Quik
Alloy:Â Sn42Bi57.6Ag0.4
Flux Type:Â No Clean
Lead Type:Â Lead Free
Powder Mesh Size:Â T3
Metal %:Â 90 %
Package Type:Â Jar
Composition:Â 42% Tin, 57.6% Bismuth, 0.4% Silver
Container Type:Â Jar
Container Volume:Â 50 g
Lead Free:Â Yes
Package:Â 50g Jar
Type:Â Solder Paste
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