
$EACH
- Description
- Specifications
Lead-free no-clean solder paste, 25-45 (T3) microns. Sn63/Pb37, 500g jar. Conforms to ANSI/J-STD-006. One year shelf life when refrigerated, 6 months at room temperature.
Brand:Â Chip Quik
Alloy:Â Sn42Bi57.6Ag0.4
Flux Type:Â No Clean
Lead Type:Â Lead Free
Powder Mesh Size:Â T3
Metal %:Â 90 %
Package Type:Â Jar
Composition:Â 42% Tin, 57.6% Bismuth, 0.4% Silver
Container Type:Â Jar
Container Volume:Â 500 g
Lead Free:Â Yes
Package:Â 500g Jar
Type:Â Solder Paste
$EACH