Chip Quik SMD291SNL15T4 Solder Paste, No Clean, Lead Free, T4, 87%, Sn96.5Ag3Cu0.5, 15g Jar
Our Part #319SO607
Mfr Part #SMD291SNL15T4
Chip Quik SMD291SNL15T4 Solder Paste, No Clean, Lead Free, T4, 87%, Sn96.5Ag3Cu0.5, 15g Jar
Our Part #319SO607
Condition:New
Mfr Part #SMD291SNL15T4
Has Expiration Date
$20.95EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $20.95 | |
| 10 | $20.53 | Save |
| 50 | $19.90 | Save |
| 100 | $18.86 | Save |
| 200 | $18.44 | Save |
Condition:New
Has Expiration Date
- Description
- Specifications
No refrigeration required! Two-part no-clean, lead-free, low-temp solder paste. Before mixing, this paste does not need to be refrigerated and has a 24 month shelf life. After mixing, the Sn96.5/Ag3.0/Cu0.5paste has a 6 month refrigerated shelf life and two months unrefrigerated. RoHS compliant. T4/15g.
Brand: Chip Quik
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T4
Metal %: 87 %
Package Type: Jar
Alternate Product Number: SAC305
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Container Type: 15g Jar
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Shelf Life: 730 days
Type: Solder Paste
$20.95EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $20.95 | |
| 10 | $20.53 | Save |
| 50 | $19.90 | Save |
| 100 | $18.86 | Save |
| 200 | $18.44 | Save |