Kester 70-0605-0811 Solder Paste, No Clean, LF, T3, 88.5%, Sn96.5Ag3Cu0.5, 600g Cart, EM907 Series
Our Part #488SO0907
Condition:New
Mfr Part #70-0605-0811
Next Day Air Only
Has Expiration Date
RoHS
$263.20Each-EA
Manufacturer Lead Time :18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $263.20 | |
| 3 | $257.94 | Save |
| 5 | $255.30 | Save |
| 10 | $250.04 | Save |
| 25 | $242.14 | Save |
- Description
- Specifications
- Initial Tackiness (typical): 44 grams
Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).
Brand: Kester
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T3
Metal %: 0.885
Halogen Content: Halogen
Alternate Product Number: SAC305, 7006050811
Container Type: Cartridge
Container Volume: 600 g
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Series: EM907 Series
Shelf Life: 120 days
Type: Solder Paste
$263.20Each-EA
Manufacturer Lead Time :18 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $263.20 | |
| 3 | $257.94 | Save |
| 5 | $255.30 | Save |
| 10 | $250.04 | Save |
| 25 | $242.14 | Save |