Kester 70-0403-0810 Solder Paste, Water Soluble, LF, T3, 89.5%, Sn96.5Ag3Cu0.5, 500g, EM828 Series
Our Part #488SO3208
Condition:New
Mfr Part #70-0403-0810
Next Day Air Only
WARNING
Has Expiration Date
RoHS
$209.13Each-EA
Manufacturer Lead Time :17 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $209.13 | |
| 3 | $204.95 | Save |
| 5 | $198.67 | Save |
| 10 | $192.40 | Save |
| 25 | $184.45 | Save |
- Description
- Specifications
- Documents
- Initial Tackiness (typical): 40 grams
Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
Brand: Kester
Alloy Name: SAC305
Flux Type: Water Soluble
Lead Free: Yes
Powder Mesh Size: T3
Metal %: 0.895
Halogen Content: Halogen
Alternate Product Number: SAC305, 7004030810
Container Type: Jar
Container Volume: 500 g
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Series: EM828 Series
Shelf Life: 180 days
Type: Solder Paste
Water Soluble: Yes
$209.13Each-EA
Manufacturer Lead Time :17 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $209.13 | |
| 3 | $204.95 | Save |
| 5 | $198.67 | Save |
| 10 | $192.40 | Save |
| 25 | $184.45 | Save |