Kester 70-0605-0810 Solder Paste, No Clean, LF, T3, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar, EM907 Series
Our Part #488SO3309
Condition:New
Mfr Part #70-0605-0810
Next Day Air Only
Has Expiration Date
RoHS
$219.74Each-EA
Quantity on Order:40
Manufacturer Lead Time :17 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $219.74 | |
| 3 | $215.35 | Save |
| 5 | $213.15 | Save |
| 10 | $208.75 | Save |
| 25 | $202.16 | Save |
- Description
- Specifications
- Documents
- Initial Tackiness (typical): 44 grams
Brand: Kester
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T3
Metal %: 0.885
Halogen Content: Halogen
Alternate Product Number: SAC305, 7006050810
Container Type: Jar
Container Volume: 500 g
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Series: EM907 Series
Shelf Life: 120 days
Type: Solder Paste
$219.74Each-EA
Quantity on Order:40
Manufacturer Lead Time :17 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $219.74 | |
| 3 | $215.35 | Save |
| 5 | $213.15 | Save |
| 10 | $208.75 | Save |
| 25 | $202.16 | Save |