Kester 70-4021-1410 Solder Paste, No Clean, LF, T4, Sn96.5Ag3Cu0.5, 500g Jar, NP505-HR Series

• High Reliability
• Classified as type ROL0 per IPC J-STD-004B
• Zero Halogen (none intentionally added)
• Reliable residues in harsh modified SIR testing with forced condensation points
• Consistent print performance to 0.55AR
• Low QFN/BGA voiding
• Excellent solderability across wide variety of profiles
• Compatible with most conformal coating materials
• Reflowable in air and nitrogen

Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, the NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B. NP505-HR is part of Kester’s high reliability product line and compatible with no-clean RF550 Rework Flux, NF372-TB Solder Flux and SELECT-10™ Selective Soldering Flux.
Designed to Handle a Wide Variety of Printer Variables