Kester 70-3213-0810 Solder Paste, No Clean, LF, T3, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar, NXG1 Series
Our Part #488SO791
Condition:New
Mfr Part #70-3213-0810
Next Day Air Only
Has Expiration Date
RoHS
$207.98Each-EA
Manufacturer Lead Time :25 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $207.98 | |
| 3 | $203.82 | Save |
| 5 | $201.74 | Save |
| 10 | $197.58 | Save |
| 25 | $191.34 | Save |
- Description
- Specifications
- Documents
- 8 month shelf life
- Offers excellent cosmetic appearance
- Long stencil & tack life
- Type ROL1, IPC ANSI/J-STD-004A
Capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading.
Brand: Kester
Alloy Name: SAC305
Flux Type: No Clean
Lead Free: Yes
Powder Mesh Size: T3
Metal %: 0.885
Halogen Content: Halogen
Alternate Product Number: SAC305, 7032130810
Container Type: Jar
Container Volume: 500 g
Alloy Type: Near-Eutectic Alloys
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Liquidus Point: 220 C (428 F)
Melting Point: 217 C (423 F)
Melting Range: 217-220 C (423-428 F)
Series: NXG1 Series
Shelf Life: 243 days
Type: Solder Paste
$207.98Each-EA
Manufacturer Lead Time :25 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $207.98 | |
| 3 | $203.82 | Save |
| 5 | $201.74 | Save |
| 10 | $197.58 | Save |
| 25 | $191.34 | Save |