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Kester

Kester 70-3213-0810 Solder Paste, No Clean, LF, T3, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar, NXG1 Series

Our Part #488SO791

Mfr Part #70-3213-0810

Kester 70-3213-0810
Kester

Kester 70-3213-0810 Solder Paste, No Clean, LF, T3, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar, NXG1 Series

Our Part #488SO791

Condition:New

Mfr Part #70-3213-0810

Next Day Air Only
Has Expiration Date
RoHS
$172.96EACH
Quantity on Order:10
Manufacturer Lead Time :22 Days
Qty:Price:Savings
1$172.96
3$169.50Save
5$167.77Save
10$164.31Save
25$159.12Save

Condition:New

Next Day Air Only
Has Expiration Date
RoHS
  • 8 month shelf life
  • Offers excellent cosmetic appearance
  • Long stencil & tack life
  • Type ROL1, IPC ANSI/J-STD-004A

Capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading.

Brand:Ā Kester
Alloy Name:Ā SAC305
Flux Type:Ā No Clean
Lead Free:Ā Yes
Powder Mesh Size:Ā T3
Metal %:Ā 88.5 %
Package Type:Ā Jar
Halogen Content:Ā Halogen
Series:Ā NXG1 Series
Alternate Product Number:Ā SAC305, 7032130810
Alloy Type:Ā Near-Eutectic Alloys
Composition:Ā 96.5% Tin, 3% Silver, 0.5% Copper
Container Type:Ā 500g Jar
Liquidus Point:Ā 220 C (428 F)
Melting Point:Ā 217 C (423 F)
Melting Range:Ā 217-220 C (423-428 F)
Shelf Life:Ā 243 days
Type:Ā Solder Paste
$172.96EACH
Quantity on Order:10
Manufacturer Lead Time :22 Days
Qty:Price:Savings
1$172.96
3$169.50Save
5$167.77Save
10$164.31Save
25$159.12Save