AIM Metals 21602 Water Soluble Solder Paste Sn96.5Ag3Cu.5 (SAC305)Type 4 88.5% 500 Gram Jar

592-455 MFG #: 21602
$113.00 / EA
13
  • Alloy: Sn96.5Ag3Cu.5 (SAC305)
  • Lead Type: Lead Free
  • Metal %: 88.5 %
  • Package Type: Jar
  • Powder Mesh Size: T4
  • Series: WS488 Series
  • Volume: 500 g
  • Drill Down Description: Water Soluble Solder Paste, Sn96.5Ag3Cu.5 (SAC305),Type 4, 88.5%, 500 Gram Jar
  • Model: 21602
  • Package: 500 Gram Jar
  • S3 Page Number Text: 285

QTY
  • Description
  • Excellent wetting
  • Extended cleaning window
  • Superior slump resistance
  • Large process window
  • Aqueous wash with water
  • J-STD-004 ORM1

AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life.